Multilayer Printed Circuit Board FR4 PCB Board of Punching Shape ENIG - Product

Other Specification : Key Specifications/Special Features - - - - Number. Of Layers: | 4 | Laminate Material: | FR4 | Surface Finish: | ENIG | Copper Thickness: | 1 Oz | Board Thickness: | 1.0 Mm | Board Size: | | Color Of Mask: | GREEN | Color Of Silkscreen: | White | Flammability: | UL 94V-0 | Workmanship: | Compliance With IPC-A-600 & IPC-6012 CLASS II | Thermal Conductivity | - | - - - - Capacity - - - - | High Precision Prototype | PCB Bulk Production | Max Layers | 1-28 Layers | 1-14 Layers | MIN Line Width(mil) | 3mil | 4mil | MIN Line Space(mil) | 3mil | 4mil | Min Via (mechanical Drilling) | Board Thickness1.2mm | 0.15mm | 0.2mm | Board Thickness2.5mm | 0.2mm | 0.3mm | Board Thickness2.5mm | Aspect Ration13:1 | Aspect Ration13:1 | Aspect Ration | Aspect Ration13:1 | Aspect Ration13:1 | Board Thickness | MAX | 8mm | 7mm | MIN | 2 Layers:0.2mm;4 Layers:0.35mm;6 Layers:0.55mm;8 Layers:0.7mm;10 Layers:0.9mm | 2 Layers:0.2mm;4 Layers:0.4mm;6 Layers:0.6mm;8layers:0.8mm | MAX Board Size | 610*1200mm | 610*1200mm | Max Copper Thickness | 0.5-6oz | 0.5-6oz | Immersion Gold/ Gold Plated Thickness | Immersion Gold:Au,18u Gold Finger:Au,1150u Gold Plated:Au,1150u Nickel Plated :50500u | | Hole Copper Thick | 25um 1mil | 25um 1mil | Tolerance | Board Thickness | Board Thickness1.0mm:+/-0.1mm 1.0mm2.0mm:+/-8% | Board Thickness1.0mm:+/-0.1mm 1.0mm2.0mm:+/-8% | Outline Tolerance | 100mm:+/-0.1mm 100< 300mm:+/-0.15mm >300mm:+/-0.2mm | 100mm:+/-0.13mm 100< 300mm:+/-0.15mm >300mm:+/-0.2mm | Impedance | 10% | 10% | MIN Solder Mask Bridge | 0.08mm | 0.10mm | Plugging Vias Capability | 0.25mm--0.60mm | 0.70mm--1.00mm | - - - - LT Circuit Co., Ltd Is A High-

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