Aluminum Round Anodized Heat Sink With 1500T Cold Forging - Product

Other Specification : Aluminum Round Anodized Heat Sink With 1500T Cold Forging This Design Is Best For High Power Led Lights . As It Is195mm Depends On Pretty Good Technology .Our Designers Use The 1500T Forging Press Machine Designed This One Solve The Dissipating Issues Of High Power Led Lightings .We Are Believe This One Is Good For Most Customers , Both Function And Apperance . Practice Has Proved , It Is Widely Used In The Huge Market And Popular In The Europe . Specifications: - - - - BaseDiameter | 195mm | BaseThickness | 7mm | TotalHight | 38mm | BodyDianeter | 4.5mm | Weight | 829g | Numberofcylinders | 263Pcs | - - - - Techniques Show : 1,Superior Cooling Performance A,The Raw Material Of Cold Forging Heat Sinks Is 1070 Pure Aluminium, The Thermal Conductivity Is 226 W/m.K, The Thickness Of The Blades Can Be Made To 0.6mm Which Increases The Heat Dissipation Superficial Area Greatly. B,While, The Thermal Conductivity Is Merely 96 W/m.K Of The Die Casting Products, Its Blades Cantbe Made Too More And Too Thin Neither. C,As To The Lathe Processing Section Aluminum Heat Sinks, The Thermal Conductivity Is Merely From 155 To 209 W/m.K, And It Must Be Split-type, The Joint Will Bring Huge Impact Of The Heat Conduction Performance, Which Result In The Efficiency Reduced About By 40 Percent. 2,All Semiconductor Devices Have Some Electrical Resistance, Justlike Resistors And Coils, Etc. This Means That When Power Diodes, Power Transistors And Power MOSFETs Are Switchingor Otherwise Controlling Reasonable Currents, They Dissipate Power . As Heat Energy. If The Device Is Not To Be Damaged Bythis, The Heat Must Be Removed From Inside The Device(usually The Collector-base Junction For A Bipolar Transistor, Orthe Drain-source Channel In A MOSFET) At A Fast Enough Rateto Prevent Excessive Temperature Rise. The Most Common Wayto Do This Is By Using A

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