Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), D ...
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 756

Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), D ...
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 794

Detailed Product Description 1.metallized film capacitor 2.small volume and light weight capacitor 3.good self-healing 4.oil filled capacitor ...
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 828

We manufacturer of all types of Change over and Main Switches.
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 907

Application: PLC, DCS analog signal data acquisition and isolation Industrial process 4-20mA signal isolation Ground-loop elimination No distortio ...
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 453

1KV ISOLATION, 1W OUTPUT, UNREGULATED, DIP 14 PACKAGE, MTBF>1M HOURS Available Inputs: 5, 12, 15 and 24 VDC Available Outputs: 3.3, 5, 9, 12 ...
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 507

Available Inputs: 3.3, 5, 9, 12, 15 and 24 VDC Available Outputs: (+/-) 5, 9, 12, 15 and 24 VDC Other specifications please enquire Sunyuan Te ...
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 432

New Vision products, do you have the feeling of shines when your first sight of it? do you like it? the main features are; 1. Full and deep bla ...
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 452

New Vision products, do you have the feeling of shines when your first sight of it? do you like it? the main features are; 1. Full and deep bla ...
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 177

1. Aluminum core, 125*73mm=1PCB 2. Double sided 3. Thermal conductivity: 2.0W/MK 4. Green solder mask/ white text 5. 2 OZ copper finished 6. 2.4m ...
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 608

1) 160*160mm, S1600 FR-4 CTI ≥ 600V, 2) 8 layer 3) Finished inner/outer: 35 μm 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 t ...
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 577

1). PCB prototypes to small volume. 2). FR-4, 0.3-5mm thick, 1-10 oz 3). 1-32 Lalyer 4). LPI Green solder mask/White legend 5). HASL, ENIG, OSP, ...
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 653

1) L1 and L4, track /space(mil) 5.1/6, precision +/-10% 90 ohm differential impedance L1, L2 and L4, track /space(mil) 6.1/7.8, precision +/-1 ...
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 850

1). 90*90mm/1up, ITEQ IT180A, FR-4 Tg170 2). 10 layer, 1.6mm thick 3). 35 μm copper finished 4). LPI Green solder mask/ white legend 5). Imme ...
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 602

1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill ...
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 558

1). Size: 72*90mm/1 up 2). Layer count: 4 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: L ...
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 559

1). 6 oz (210μm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend ...
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 891

1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6 ...
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 584