Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), D ...
Explore More



 926

Detailed Product Description 1.metallized film capacitor 2.small volume and light weight capacitor 3.good self-healing 4.oil filled capacitor ...
Explore More



 960

Application: PLC, DCS analog signal data acquisition and isolation Industrial process 4-20mA signal isolation Ground-loop elimination No distortio ...
Explore More



 552

1KV ISOLATION, 1W OUTPUT, UNREGULATED, DIP 14 PACKAGE, MTBF>1M HOURS Available Inputs: 5, 12, 15 and 24 VDC Available Outputs: 3.3, 5, 9, 12 ...
Explore More



 640

Available Inputs: 3.3, 5, 9, 12, 15 and 24 VDC Available Outputs: (+/-) 5, 9, 12, 15 and 24 VDC Other specifications please enquire Sunyuan Te ...
Explore More



 581

New Vision products, do you have the feeling of shines when your first sight of it? do you like it? the main features are; 1. Full and deep bla ...
Explore More



 580

New Vision products, do you have the feeling of shines when your first sight of it? do you like it? the main features are; 1. Full and deep bla ...
Explore More



 297

1. Aluminum core, 125*73mm=1PCB 2. Double sided 3. Thermal conductivity: 2.0W/MK 4. Green solder mask/ white text 5. 2 OZ copper finished 6. 2.4m ...
Explore More



 716

1) 160*160mm, S1600 FR-4 CTI ≥ 600V, 2) 8 layer 3) Finished inner/outer: 35 μm 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 t ...
Explore More



 723

1). PCB prototypes to small volume. 2). FR-4, 0.3-5mm thick, 1-10 oz 3). 1-32 Lalyer 4). LPI Green solder mask/White legend 5). HASL, ENIG, OSP, ...
Explore More



 761

1) L1 and L4, track /space(mil) 5.1/6, precision +/-10% 90 ohm differential impedance L1, L2 and L4, track /space(mil) 6.1/7.8, precision +/-1 ...
Explore More



 975

1). 90*90mm/1up, ITEQ IT180A, FR-4 Tg170 2). 10 layer, 1.6mm thick 3). 35 μm copper finished 4). LPI Green solder mask/ white legend 5). Imme ...
Explore More



 707

1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill ...
Explore More



 661

1). Size: 72*90mm/1 up 2). Layer count: 4 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: L ...
Explore More



 669

1). 6 oz (210μm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend ...
Explore More



 1,019

1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6 ...
Explore More



 696

1) RO4350B and RO4003C RO4350B 4mil(0.1mm) 10mil(0.254mm) 13.3mil(0.338mm) 20mil (0.508mm) 30mil(0.762mm) 60mil(1.524mm) RO4003C ...
Explore More



 786