Sputter Coating Application: Sputter coating thin film primary be used field include decorate thin film, construction glass, automobile widow, low rad ...
Explore More



 738

Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), D ...
Explore More



 756

Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), D ...
Explore More



 794

1KV ISOLATION, 1W OUTPUT, UNREGULATED, DIP 14 PACKAGE, MTBF>1M HOURS Available Inputs: 5, 12, 15 and 24 VDC Available Outputs: 3.3, 5, 9, 12 ...
Explore More



 506

Available Inputs: 3.3, 5, 9, 12, 15 and 24 VDC Available Outputs: (+/-) 5, 9, 12, 15 and 24 VDC Other specifications please enquire Sunyuan Te ...
Explore More



 432

Application: PLC, DCS analog signal data acquisition and isolation Industrial process 4-20mA signal isolation Ground-loop elimination No distortio ...
Explore More



 453

New Vision products, do you have the feeling of shines when your first sight of it? do you like it? the main features are; 1. Full and deep bla ...
Explore More



 452

New Vision products, do you have the feeling of shines when your first sight of it? do you like it? the main features are; 1. Full and deep bla ...
Explore More



 176

1. Aluminum core, 125*73mm=1PCB 2. Double sided 3. Thermal conductivity: 2.0W/MK 4. Green solder mask/ white text 5. 2 OZ copper finished 6. 2.4m ...
Explore More



 607

1) 160*160mm, S1600 FR-4 CTI ≥ 600V, 2) 8 layer 3) Finished inner/outer: 35 μm 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 t ...
Explore More



 576

1). PCB prototypes to small volume. 2). FR-4, 0.3-5mm thick, 1-10 oz 3). 1-32 Lalyer 4). LPI Green solder mask/White legend 5). HASL, ENIG, OSP, ...
Explore More



 652

1) L1 and L4, track /space(mil) 5.1/6, precision +/-10% 90 ohm differential impedance L1, L2 and L4, track /space(mil) 6.1/7.8, precision +/-1 ...
Explore More



 849

1). 90*90mm/1up, ITEQ IT180A, FR-4 Tg170 2). 10 layer, 1.6mm thick 3). 35 μm copper finished 4). LPI Green solder mask/ white legend 5). Imme ...
Explore More



 601

1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill ...
Explore More



 557

1). Size: 72*90mm/1 up 2). Layer count: 4 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: L ...
Explore More



 558

1). 6 oz (210μm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend ...
Explore More



 890

1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6 ...
Explore More



 583