Sputter Coating Application: Sputter coating thin film primary be used field include decorate thin film, construction glass, automobile widow, low rad ...
Explore More



 821

Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), D ...
Explore More



 832

Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), D ...
Explore More



 873

1KV ISOLATION, 1W OUTPUT, UNREGULATED, DIP 14 PACKAGE, MTBF>1M HOURS Available Inputs: 5, 12, 15 and 24 VDC Available Outputs: 3.3, 5, 9, 12 ...
Explore More



 592

Available Inputs: 3.3, 5, 9, 12, 15 and 24 VDC Available Outputs: (+/-) 5, 9, 12, 15 and 24 VDC Other specifications please enquire Sunyuan Te ...
Explore More



 533

New Vision products, do you have the feeling of shines when your first sight of it? do you like it? the main features are; 1. Full and deep bla ...
Explore More



 536

New Vision products, do you have the feeling of shines when your first sight of it? do you like it? the main features are; 1. Full and deep bla ...
Explore More



 253

1. Aluminum core, 125*73mm=1PCB 2. Double sided 3. Thermal conductivity: 2.0W/MK 4. Green solder mask/ white text 5. 2 OZ copper finished 6. 2.4m ...
Explore More



 675

1) 160*160mm, S1600 FR-4 CTI ≥ 600V, 2) 8 layer 3) Finished inner/outer: 35 μm 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 t ...
Explore More



 673

1). PCB prototypes to small volume. 2). FR-4, 0.3-5mm thick, 1-10 oz 3). 1-32 Lalyer 4). LPI Green solder mask/White legend 5). HASL, ENIG, OSP, ...
Explore More



 718

1) L1 and L4, track /space(mil) 5.1/6, precision +/-10% 90 ohm differential impedance L1, L2 and L4, track /space(mil) 6.1/7.8, precision +/-1 ...
Explore More



 922

1). 90*90mm/1up, ITEQ IT180A, FR-4 Tg170 2). 10 layer, 1.6mm thick 3). 35 μm copper finished 4). LPI Green solder mask/ white legend 5). Imme ...
Explore More



 669

1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill ...
Explore More



 621

1). Size: 72*90mm/1 up 2). Layer count: 4 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: L ...
Explore More



 625

1). 6 oz (210μm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend ...
Explore More



 966

1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6 ...
Explore More



 651

1) RO4350B and RO4003C RO4350B 4mil(0.1mm) 10mil(0.254mm) 13.3mil(0.338mm) 20mil (0.508mm) 30mil(0.762mm) 60mil(1.524mm) RO4003C ...
Explore More



 743