Place of Origin : Shenzhen,China

Quick DetailsNumber of Layers:1-LayerBase Material:Aluminum and copper mixCopper Thickness:1ozBoard Thickness:0.2-5mmMin. Hole Size:0.4mmMin. Line Width:10milMin. Line Spacing:10milSurface Finishing:ENIG1u”Minimum Order Quantity:NO MOQ SoldermaskWhiteQuantityIPC2Quick-turn service with prototype24 hours LogisticsFedexCertificateUL,ISO,Rohs