Green Solder Mask 1 - 14 Layers High TG Multilayer PCB Boards 0.5 - 6oz - Product
Place of Origin : Nanhai,China
Delivery Time : 5-12Days
Product Description
Green Solder Mask 1 - 14 Layers High TG Multilayer PCB Boards 0.5 - 6oz
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| High precision prototype | PCB bulk production |
Max Layers | 1-28 layers | 1-14 layers |
MIN Line width(mil) | 3mil | 4mil |
MIN Line space(mil) | 3mil | 4mil |
Min via (mechanical drilling) | Board thickness1.2mm | 0.15mm | 0.2mm |
Board thickness2.5mm | 0.2mm | 0.3mm |
Board thickness2.5mm | Aspect Ration13:1 | Aspect Ration13:1 |
Aspect Ration | Aspect Ration13:1 | Aspect Ration13:1 |
Board thickne
Physical Specification
Other Specification : Green Solder Mask 1 - 14 Layers High TG Multilayer PCB Boards 0.5 - 6oz
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| High Precision Prototype | PCB Bulk Production |
Max Layers | 1-28 Layers | 1-14 Layers |
MIN Line Width(mil) | 3mil | 4mil |
MIN Line Space(mil) | 3mil | 4mil |
Min Via (mechanical Drilling) | Board Thickness1.2mm | 0.15mm | 0.2mm |
Board Thickness2.5mm | 0.2mm | 0.3mm |
Board Thickness2.5mm | Aspect Ration13:1 | Aspect Ration13:1 |
Aspect Ration | Aspect Ration13:1 | Aspect Ration13:1 |
Board Thickness | MAX | 8mm | 7mm |
MIN | 2 Layers:0.2mm;4 Layers:0.35mm;6 Layers:0.55mm;8 Layers:0.7mm;10 Layers:0.9mm | 2 Layers:0.2mm;4 Layers:0.4mm;6 Layers:0.6mm;8layers:0.8mm |
MAX Board Size | 610*1200mm | 610*1200mm |
Max Copper Thickness | 0.5-6oz | 0.5-6oz |
Immersion Gold/Gold Plated Thickness | Immersion Gold:Au,18u
Gold Finger:Au,1150u
Gold Plated:Au,1150u
Nickel Plated :50500u | |
Hole Copper Thick | 25um 1mil | 25um 1mil |
Tolerance | Board Thickness | Board Thickness1.0mm:+/-0.1mm
1.0mm2.0mm:+/-8% | Board Thickness1.0mm:+/-0.1mm
1.0mm2.0mm:+/-8% |
Outline Tolerance
| 100mm:+/-0.1mm
100< 300mm:+/-0.15mm
>300mm:+/-0.2mm | 100mm:+/-0.13mm
100< 300mm:+/-0.15mm
>300mm:+/-0.2mm |
Impedance | 10% | 10% |
MIN Solder Mask Bridge | 0.08mm | 0.10mm |
Plugging Vias Capability | 0.25mm--0.60mm | 0.70mm--1.00mm |
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Description
1.Professional Manufacturer Of PCB And PCB Assembly Specialized In Single-sided PCB, Double-sided PCB, Multilayer PCB, PCB Layout And Design And PCB Assembly
2. Material Type: FR4,non-halogen Material ,Aluminium Base,Cooper Base,high Frequency Material ,Thick Copper Foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface Treatment: HAL,Immersion Gold,Immersion Tin,Immersion Silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion Silver,Immersion Tin)+Gold Finger
Application
Products Are Applied To A Wide Range Of High-tech Industries Such