Electronic Circuit Board Through Hole PCB Assembly PCBA Service - Product
Place of Origin : Shenzhen,China
Delivery Time : 15-20 Working Days
Product Description
Electronic Circuit Board Through Hole PCB Assembly PCBA Service
Specifications
1.Ourprofessionalengineeringteamcanputyourprojectintoproductioninashorttime.Samplepicturesand
BOMareneededtomakecustomizedproducts.AlsowecansupplyforthecopyofthePCBandPCBA,soyou
justsentmetheenquiryisok,wecandowhatyouneedtodo!
2.WecansupplyCADandPro-Edesignedprecisionmoulds.Mouldscanbedesignedandmanufactured
accordingtocustomers'requestsorsamples.Plasticinjectionprocessingavailable.
3.Purcha
Physical Specification
Other Specification :
Electronic Circuit Board Through Hole PCB Assembly PCBA Service
Specifications
1.Ourprofessionalengineeringteamcanputyourprojectintoproductioninashorttime.Samplepicturesand
BOMareneededtomakecustomizedproducts.AlsowecansupplyforthecopyofthePCBandPCBA,soyou
Justsentmetheenquiryisok,wecandowhatyouneedtodo!
2.WecansupplyCADandPro-Edesignedprecisionmoulds.Mouldscanbedesignedandmanufactured
Accordingtocustomers'requestsorsamples.Plasticinjectionprocessingavailable.
3.PurchasingtheelectroniccomponentsforyoutotheproductionofthePCBA
4.Wehaveadvancedequipmentforthrough-holeandSMTDIPCOBcableAssembly
5.ROHScompliantandlead-freeprocess.
6.In-circuit,functionaltests&burn-intests,fullsystemtest
7.Highoutputtoguaranteepromptdelivery.
WelcometoHuaswin!
HuaswinElectronicsisaprofessionalPCB&PCBAssemblymanufacturer,locatedinShenzhen,China.
Wesupplyone-stopfacilityservices:PCBdesign,PCBfabrication,componentsprocurement,SMTandDIP
Assembly,ICpre-programming/burningon-line,testing,anti-staticpacking.
PCBcapabilityandservices:
1.Single-sided,double-sided&multi-layerPCB(upto30layers)
2.FlexiblePCB(upto10layers)
3.Rigid-flexPCB(upto8layers)
4.CEM-1,CEM-3FR-4,FR-4HighTG,Polyimide,Aluminum-basedmaterial.
5.HAL,HALleadfree,ImmersionGold/Silver/Tin,HardGold,OSPsurfacetreatment.
6.PrintedCircuitBoardsare94V0compliant,andadheretoIPC610Class2internationalPCBstandard.
7.Quantitiesrangefromprototypetovolumeproduction.
8.100%E-Test
DetailedSpecificationofPCBManufacturing
- - - -
1 | Layer | 1-30layer |
2 | Material | CEM-1,CEM-3FR-4,FR-4HighTG,Polyimide, Aluminum-basedmaterial. |
3 | Boardthickness | 0.2mm-6mm |
4 | Max.finishedboardsize | 800*508mm |
5 | Min.drilledholesize | 0.25mm |
6 | Min.linewidth | 0.075mm(3mil) |
7 | Min.linespacing | 0.075m