FlexiblePrinted Circuit Board SMT PCB Assembly 1 Layer - 30 Layer - Product

Other Specification :  Flexible Printed Circuit Board SMT PCB Assembly 1 Layer - 30 Layer Specifications 1.ThehighstandardworkshopsforSMT,DIP,andAssemblingensureourstrongprocessingcapacity. 2.Abundantexperienceandstrongabilityinmaterialsourcing,manufacturing,testandqualitymanagement. 3.Productsinkindsoffields,suchasPower,Communicationequipment,remotecontrolsystem,carDVD, GPSnavigationandconsumerelectronicproductsetc. WelcometoHuaswin! HuaswinElectronicsisaprofessionalPCB&PCBAssemblymanufacturer,locatedinShenzhen,China. Wesupplyone-stopfacilityservices:PCBdesign,PCBfabrication,componentsprocurement,SMTandDIP Assembly,ICpre-programming/burningon-line,testing,packing. PCBcapabilityandservices: 1.Single-sided,double-sided&multi-layerPCB(upto30layers) 2.FlexiblePCB(upto10layers) 3.Rigid-flexPCB(upto8layers) 4.CEM-1,CEM-3FR-4,FR-4HighTG,Polyimide,Aluminum-basedmaterial. 5.HAL,HALleadfree,ImmersionGold/Silver/Tin,HardGold,OSPsurfacetreatment. 6.PrintedCircuitBoardsare94V0compliant,andadheretoIPC610Class2internationalPCBstandard. 7.Quantitiesrangefromprototypetovolumeproduction. 8.100%E-Test DetailedSpecificationofPCBManufacturing - - - - 1 | Layer | 1-30layer | 2 | Material | CEM-1,CEM-3FR-4,FR-4HighTG,Polyimide, Aluminum-based Material. | 3 | Boardthickness | 0.2mm-6mm | 4 | Max.finishedboardsize | 800*508mm | 5 | Min.drilledholesize | 0.25mm | 6 | Min.linewidth | 0.075mm(3mil) | 7 | Min.linespacing | 0.075mm(3mil) | 8 | Surfacefinish | HAL,HALLeadfree,ImmersionGold/Silver/Tin,HardGold, OSP | 9 | Copperthickness | 0.5-4.0oz | 10 | Soldermaskcolor | Green/black/white/red/blue/yellow | 11 | Innerpacking | Vacuumpacking,Plasticbag | 12 | Outerpacking | Standardcartonpacking | 13 | Holetolerance | PTH

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