FR4 Base Material 8 Layers Multilayer Gold Finger Prototypes Rigid Printed Circuit Board - Product

Other Specification :  FR4 Base Material 8 Layers Multilayer Gold Finger Prototypes Rigid Printed Circuit Board Base Material: FR4 No Of Layers:8 Finished Thickness:1.2mm Copper Weight:35/35um Min Copper Width:4mil Min Copper Clearance:4mil Min Via:0.2mm Aspect Ratio:6:1 Min Spacing From Via To Copper:10mil Layer To Layer Registration<3mil Impedance Control Surface Finish:HASL+Hard Gold Finger Applications: Consumer Electrical Products, Industrial Control Board, Power Supplier, IT Products, Computing Machine, Telecommunication Field, Aerospace Industrial, Military Use. Specifications: - - - - Process Capability | Item | Standard | Limit | Base Material | FR4,FR4TG170,FR4TG180,Halogen Free FR4 | Rogers,Arlon,Taconicc,Bergquist | No Of Layer | 1-12layer | 40layer | Array Size | 30X30mm-400x400mm | 6X6mm And 860x610MM | Board Thickness | 1.6mm | Min:0.2mm;Max:7mm | Copper Weight | 18/35um | 420um | Copper Etching | 4/4mil Or Up | 3/3mil | Finished Hole Size | 0.25mm Or Up | 0.1mm | Hole-Copper Spacing | 8mil | 6mil | Hole Barrel Copper | 20um | 25um | Aspect Ratio | 9:1 Or Less | 16:1 | Immersion Gold | 2U'' | 5U'' | Gold Fingers | 30U'' | 50U'' | Impedance Control | +/-10% | +/-5% | Via In Pad | Resin Filling Via | Copper Filling Via | Copper To Edge | 8mil | 6mil | Mask Clearance | 3mil | 2mil | Bow And Twist | 0.75% | 0.5% | Leadtime | 4Working Days | 24hours | Quality Control | IPC Class 2 | IPC Class 3 | - - - - Competitive Advantage: The Leading Pcb Supplier In China Good System Of Management And Quality Control Fast Turn Manufacturing Timely Delivery High Quality And Competitive Price Fast Response To Any Inquiry

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